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US Patent Issued to Innovative Technology on Feb. 24 for "Coin apparatus" (British Inventors)

ALEXANDRIA, Va., Feb. 24 -- United States Patent no. 12,562,017, issued on Feb. 24, was assigned to Innovative Technology Ltd. (Oldham, Great Britain). "Coin apparatus" was invented by Paul Clark (Ol... Read More


US Patent Issued to The Board of Trustees of the Leland Stanford Junior University on Feb. 24 for "Devices and methods directed to sensing using synthetic materials" (California Inventors)

ALEXANDRIA, Va., Feb. 24 -- United States Patent no. 12,558,800, issued on Feb. 24, was assigned to The Board of Trustees of the Leland Stanford Junior University (Stanford, Calif.). "Devices and met... Read More


US Patent Issued to Aito on Feb. 24 for "Piezoelectric user interface arrangement, and method for driving piezoelectric elements in a user interface arrangement" (Finnish Inventors)

ALEXANDRIA, Va., Feb. 24 -- United States Patent no. 12,558,706, issued on Feb. 24, was assigned to Aito BV (Amsterdam). "Piezoelectric user interface arrangement, and method for driving piezoelectri... Read More


US Patent Issued to UPL on Feb. 24 for "Process for preparation of intermediates" (Emirati, Indian Inventors)

ALEXANDRIA, Va., Feb. 24 -- United States Patent no. 12,559,466, issued on Feb. 24, was assigned to UPL LTD (Haldia, India). "Process for preparation of intermediates" was invented by Santosh Ganpat ... Read More


US Patent Issued to Digital Global Systems on Feb. 24 for "Systems and methods of sensor data fusion" (Florida Inventor)

ALEXANDRIA, Va., Feb. 24 -- United States Patent no. 12,561,405, issued on Feb. 24, was assigned to Digital Global Systems Inc. (Tysons Corner, Va.). "Systems and methods of sensor data fusion" was i... Read More


US Patent Issued to SAMSUNG ELECTRONICS on Feb. 24 for "Memory module having first connection bumps and second connection bumps" (South Korean Inventor)

ALEXANDRIA, Va., Feb. 24 -- United States Patent no. 12,564,080, issued on Feb. 24, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Memory module having first connection bumps ... Read More


US Patent Issued to Hanwha Solutions on Feb. 24 for "Laminated passivation structure of solar cell and preparation method thereof" (Chinese Inventors)

ALEXANDRIA, Va., Feb. 24 -- United States Patent no. 12,563,856, issued on Feb. 24, was assigned to Hanwha Solutions Corp. (Seoul, South Korea). "Laminated passivation structure of solar cell and pre... Read More


US Patent Issued to Michael R. Saldana on Feb. 24 for "Image intensifier with dynamic optocoupler elements" (Texas Inventors)

ALEXANDRIA, Va., Feb. 24 -- United States Patent no. 12,562,332, issued on Feb. 24, was assigned to Michael R. Saldana (New Braunfels, Texas). "Image intensifier with dynamic optocoupler elements" wa... Read More


US Patent Issued to GE Infrastructure Technology on Feb. 24 for "Erosion resistant coatings applied by variable bias cathodic arc deposition" (American, French Inventors)

ALEXANDRIA, Va., Feb. 24 -- United States Patent no. 12,559,845, issued on Feb. 24, was assigned to GE Infrastructure Technology LLC (Greenville, S.C.). "Erosion resistant coatings applied by variabl... Read More


US Patent Issued on Feb. 24 for "Silicon oxide based high capacity anode materials for lithium ion batteries" (California Inventors)

ALEXANDRIA, Va., Feb. 24 -- United States Patent no. 12,562,366, issued on Feb. 24. "Silicon oxide based high capacity anode materials for lithium ion batteries" was invented by Haixia Deng (Fremont,... Read More